Semiconductor device and manufacturing method for the same

ABSTRACT

A semiconductor device includes interlayer insulating layers and conductive patterns alternately stacked over a pipe gate, a first slit and a second slit penetrating the interlayer insulating layers and the conductive patterns and crossing each other, an etch stop pad groove overlapping an intersection of the first slit and the second slit, arranged in the pipe gate, and connected to the first slit or the second slit, and slit insulating layers filling the first slit, the second slit and the etch stop pad groove.

CROSS REFERENCE TO RELATED APPLICATION

The present application claims a priority to a Korean patent applicationnumber 10-2016-0026537 filed on Mar. 4, 2016, the entire disclosure ofwhich is incorporated herein by reference in its entirety.

BACKGROUND 1. Technical Field

Embodiments of the present disclosure generally relate to asemiconductor device and a manufacturing method thereof, moreparticularly, to a three dimensional memory device and a method formanufacturing the same.

2. Discussion of Related Arts

The semiconductor device may include a memory device that stores data.The memory device may include memory cells. For a high integration ofthe semiconductor device, the memory cells may be arranged in threedimensions. The memory cells arranged in three dimensions may be coupledto conductive patterns arranged at different heights from each other.The conductive patterns may be penetrated by slits formed in a varietyof shapes.

The slits described above may overlap with each other. A substrate maybe damaged by an over etch in an area in which the slits overlap witheach other, or a bottom of the slit may be too close to the substrate.In this case, a leakage current occurs to the substrate through aconductive material that remains in the bottom of the slit, such thatoperational reliability of the semiconductor device may be reduced.

SUMMARY

Various embodiments are directed to a semiconductor device capable ofimproving an operational reliability of the semiconductor device, and amanufacturing method thereof.

In one aspect of the present disclosure, there is provided asemiconductor device including interlayer insulating layers andconductive patterns alternately stacked over a pipe gate, a first slitand a second slit penetrating the interlayer insulating layers and theconductive patterns and crossing each other, an etch stop pad grooveoverlapping an intersection of the first slit and the second slit,arranged in the pipe gate, and connected to the first slit or the secondslit, and slit insulating layers filling the first slit, the second slitand the etch stop pad groove.

In one aspect of the present disclosure, there is provided amanufacturing method for a semiconductor device, the manufacturingmethod including forming a pipe gate in which an etch stop pad groovefilled with an etch stop pattern is formed, alternately stacking firstmaterial layers and second material layers over the pipe gate, forming afirst slit penetrating the first material layers and the secondmateriallayers and overlapping the etch stop pattern, opening the etch stop padgroove by removing the etch stop pattern through the first slit, forminga first slit insulating layer filling the first slit and the etch stoppad groove, and forming a second slit penetrating the first materiallayers and the second material layers, the second slit crossing thefirst slit in an overlapping portion of the first slit and the etch stoppad groove.

In one aspect of the present disclosure, there is provided amanufacturing method for a semiconductor device, the manufacturingmethod including forming a pipe gate in which an etch stop pad groovefilled with an etch stop pattern is formed, alternately stacking firstmaterial layers and second material layers over the pipe gate, forming afirst slit penetrating the first material layers and the second materiallayers and overlapping the etch stop pattern, forming a first slitinsulating layer in the first slit, forming a second slit penetratingthe first material layers and the second material layers, the secondslit intersecting the first slit in an overlapping portion of the firstslit and the etch stop pad groove, removing the etch stop patternthrough the second slit, and forming a second slit insulating layerfiling the second silt and the etch stop pad groove.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a view of a cell area and a contact area of a memorydevice according to an embodiment of the present disclosure.

FIG. 2 illustrates a perspective view of a cell array of a memory deviceaccording to an embodiment of the present disclosure.

FIG. 3A illustrates a plane view of a layout of a memory deviceaccording to an embodiment of the present disclosure.

FIGS. 3B and 3C illustrate cross sectional views of various structurestaken along line A-A′ shown in FIG. 3A,

FIG. 4A illustrates a plane view of a layout of a memory deviceaccording to an embodiment of the present disclosure.

FIGS. 4B and 4C illustrate cross sectional views of various structurestaken along line B-B′ shown in FIG. 4A.

FIGS. 5A to 8C illustrate cross sectional views of a manufacturingmethod of a memory device according to an embodiment of the presentdisclosure.

FIGS. 9 to 10C illustrate cross sectional views of manufacturing methodof a memory device according to an embodiment of the present disclosure.

FIG. 11 illustrates a configuration view of a memory system according toan embodiment of the present disclosure.

FIG. 12 illustrates a configuration view of a computing system accordingto an embodiment of the present disclosure.

DETAILED DESCRIPTIONS

Embodiments are provided to transfer the spirit and the scope of thedisclosure to those skilled in the art to which the disclosure pertains.Accordingly, it will be understood by those of skill in the art thatvarious changes in form and details may be made without departing fromthe spirit and scope of the disclosure as set forth in the followingclaims. Therefore, the technical range of the present disclosure is notlimited to the detailed description of the specification but defined bythe range of the claims.

The present disclosure provides a semiconductor device improving anoperational reliability thereof, and a method for manufacturing thesame.

FIG. 1 illustrates a view of a cell area and a contact area of a memorydevice according to an embodiment of the present disclosure.

Referring to FIG. 1, the memory device according to the embodiment ofthe present disclosure may be formed over a substrate, the substrateincluding a cell area CA and contact areas CTA1 and CTA2 extending alonga first direction I from the cell area CA.

A cell array may be arranged on a cell area CA. The cell array mayinclude memory blocks. Each of the memory blocks may include memorycells. Each of the memory cells may store one or more bits. The memorycells may be connected in series through a channel layer to form amemory string. One end of the channel layer may be connected to a bitline, and the other end of the channel layer may be connected to acommon source line. The channel layer may be surrounded with conductivepatterns spaced apart from each other and stacked on the substrate. Theconductive patterns may be connected to gates of memory cells. Theconductive patterns may extend along the first direction I from an upperportion of the cell area CA to an upper portion of contact areas CTA1and CTA2. The conductive patterns may form a step structure in the upperportion of the contact areas CTA1 and CTA2.

The memory string formed on the cell area CA may be formed in variousstructures. For example, the memory string may be formed as a U type ora W type. The structure of the memory string will be described below inmore detail with reference to FIG. 2,

Ends of the conductive patterns may extend from the cell area CA and bedisposed on the contact areas CTA1 and CTA2. The contact areas mayinclude a first contact area CTA1 and a second contact area CTA2 withthe cell area CA interposed therebetween.

FIG. 2 illustrates a perspective view of a cell array of a memory deviceaccording to an embodiment of the present disclosure. For theconvenience of description, a plurality of insulating layers including atunnel insulating layers a data storage layer, a blocking insulatinglayer, and interlayer insulating layers are not shown in FIG. 2.

Referring to FIG. 2, the cell array according to the embodiment of thepresent disclosure may include the memory cells stacked along anextending direction of each of channel layers CH1 and CH2, The channellayers CH1 and CH2 may include a lower channel layer CH1 and an upperchannel layer CH2

The lower layer channel CH1 may include a lower pipe channel layer P_CH1and at least a pair of lower channel pillars S_CH1 and D_CH1 extendingfrom the lower pipe channel layer P_CH1. The lower channel pillars mayinclude a source side lower channel pillar S_CH1 and a drain side lowerchannel pillar D_CH1 extending from both ends of the lower pipe channellayer P_CH1.

The upper layer channel CH2 may include an upper pipe channel layerP_CH2 and at least a pair of upper channel pillars S_CH2 and D_CH2extending from the upper pipe channel layer P_CH2. The upper channelpillars may include a source side upper channel pillar S_CH2 and a drainside upper channel pillar D_CH2 extending from both ends of the upperpipe channel layer P_CH2.

Each of the lower channel layer CH1 and the upper channel layer CH2 maybe formed as a tubular-type semiconductor layer surrounding a centralarea of a hole filled with an insulating material. Each of the lowerchannel layer CH1 and the upper channel layer CH2 may be formed as aburied-type semiconductor layer completely filling from a surface to acentral area of a hole. The hole may define an area on which the lowerchannel layer CH1 or the upper channel layer CH2 is arranged. Each ofthe lower channel layer CH1 and the upper channel layer CH2 may beformed in a structure mixed with the buried-type and the tubular-typesemiconductor layers. Although not shown in the drawings, an outer wallof each of the lower channel layer CH1 and the upper channel layer CH2may be surrounded by three layers or more including a tunnel insulatinglayer, a memory layer, and a charge blocking layer.

The lower pipe channel layer P_CH1 and the upper pipe channel layerP_CH2 may be surrounded by a pipe gate PG. The pipe gate PG may beformed of a stacked structure including a first pipe conductive layerPG1, a second pipe conductive layer PG2 and a third pipe conductivelayer PG3.

The lower pipe channel layer P_CH1 and the upper pipe channel layerP_CH2 may be arranged inside the pipe gate PG. More specifically, thelower pipe channel layer P_CH1 may be disposed inside the first pipeconductive layer PG1. The lower pipe channel layer P_CH1 may be disposedto fill a lower pipe groove PA1 formed inside the first pipe conductivelayer PG1. The lower pipe channel layer P_CH1 may be covered with asecond pipe conductive layer PG2 disposed on the first pipe conductivelayer PG1. The upper pipe channel layer P_CH2 may be disposed inside thesecond pipe conductive layer PG2. The upper pipe channel layer P_CH2 maybe disposed to fill an upper pipe groove PA2 formed inside the secondpipe conductive layer PG2. The upper pipe channel layer P_CH2 may becovered with a third pipe conductive layer PG3 disposed on the secondpipe conductive layer PG2.

The second pipe conductive layer PG2 and the third pipe conductive layerPG3 may be penetrated by the source side lower channel pillar S_CH1 andthe drain side lower channel pillar D_CHL The third pipe conductivelayer PG3 may be penetrated by the source side upper channel pillarS_CH2 and the drain side upper channel pillar D_CH2.

According to the above structure, the lower pipe groove PA1 and thelower pipe channel layer P_CH may be arranged at a lower height than theupper pipe groove PA2 and the upper pipe channel layer P_CH2. Inaddition, the lower pipe groove PA1 and the lower pipe layer channelP_CH1 may be spaced apart from the upper pipe groove PA2 and the upperpipe thannel layer P_CH2.

The upper pipe channel layer P_CH2 may be formed shorter than the lowerpipe channel layer P_CH1 and placed at a position higher than the lowerpipe channel layer P_CH1. The upper pipe channel layer P_CH2 and thelower pipe channel layer P_CH1 that are formed in a different horizontallength at different heights according to an io embodiment of the presentdisclosure may be more densely arranged than the pipe channel layersformed with the same horizontal length at the same height. Accordingly,the embodiment of the present disclosure may improve the degree ofintegration of the memory device.

The pipe gate PG may extend along a first direction I and a seconddirection H crossing each other. Each of the source side lower channelpillar S_CH1, the drain side lower channel pillar D_CH1, the source sideupper channel pillar S_CH2, and the drain side upper channel pillarD_CH2 may extend along a third direction ITT perpendicular to a surfaceof the pipe gate PG,

A top end of the source side lower channel pillar S_CH1 and a top end ofthe source side upper channel pillar S_CH2 may be connected to thecommon source line SL. A top end of the drain side lower channel pillarD_CH1 and a top end of the drain side upper channel pillar D_CH2 may beconnected to the bit line BL corresponding thereto, respectively.

The bit line BL and the common source line SL may be disposed on anupper portion of the structure including the pipe gate P. The bit linesBL may be placed on a different layer from the common source line SL.For example, the bit line BL may be placed at a position higher than thecommon source line SL. The common source line SL may extend in the firstdirection I , and the bit line BL may be extend along the seconddirection II.

Conductive patterns S_CP and D_CP may be stacked and to spaced apartalong the third direction IlI between the pipe gate PG and one of thecommon source line SL and the bit line BL. The conductive patterns S_CPand D_CP may be separated into drain side conductive patterns D_CP andsource side conductive patterns S_CP by the slit. The drain sideconductive patterns D_CP and the source side conductive patterns S_CPmay extend along the first direction I.

The source side lower channel pillar S_CH1 and the source side upperchannel pillar S_CH2 may pass through the source side conductivepatterns S_CP. The source side conductive patterns S_CP may be arrangedbetween the pipe gate PG and the common source line SL, stacked andspaced apart along the third direction III. The source side conductivepatterns S_CP may include source side word lines S_WL, and at least onelayer of a source select line SSL stacked on an upper portion of thesource side word lines S_WL.

The drain side lower channel pillar D_CH1 and the drain side upperchannel pillar D_CH2 may pass through drain side conductive patternsD_CP. The drain side conductive patterns D_CP may be arranged betweenthe pipe gate PG and the bit line BL, stacked and spaced apart along thethird direction HI. The drain side conductive patterns D_CP may includedrain side word lines D_WL, and at least one layer of a drain selectline DSL stacked on an upper portion of the drain side word lines D_WL.The drain select line DSL may be spaced apart from the drain side wordlines D_WL.

According to the above described structure, a pipe transistor may beformed at intersections of the pipe gate PG and the lower channel layerCH1 or at intersections of the pipe gate PG and the upper channel layerCH2. The memory cells may be formed at intersections of word lines D_WLand S_WL and the lower channel layer CH1, and at intersections of theword lines D_WL and S_WL and the upper channel layer CH2, Source selecttransistors may be formed at an intersection of the source select lineSSL and the lower channel layer CH1 and at an in tersection of thesource select line SSL and the upper channel layer CH2. Drain selecttransistors may be formed at intersections of the drain select line DSLand the lower channel layer CH1 and at intersections of the drain selectline DSL and the upper channel layer CH2. Thus, a first memory stringincluding the drain select transistor, the memory cells, the pipetransistor and the source select transistor connected in series by thelower channel layer CH1 may be connected between the bit line BLcorresponding thereto and the common source line SL. Further, a secondmemory string including the drain select transistor, the memory cells,the pipe transistor and the source select transistor connected in seriesby the upper channel layer CH2 may be connected between the bit line BLcorresponding thereto and the common source line SL. The first memorystring and the second memory string may be densely arranged by denselyarranging the lower pipe channel layer P_CH1 and the upper pipe channellayer P_CH2, such that the embodiment of the present disclosure mayimprove the degree of integration of the memory device in a limitedspace.

FIG. 3A illustrates a plane view of a layout of a memory device,according to an embodiment of the present disclosure. FIG. 3A primarilyillustrates a cell area CA and a contact area CTA connected to one endof the cell area CA.

Referring to FIG. 3A, the memory device comprises memory block stackbodies MB1 and MB2. Each of the memory bl ock stack bodies MB1 and MB2includes the cell area CA and the contact area CTA. The contact area CTAmay extend in a first direction I from at least one side of the cell reaCA.

Each of the memory block stack bodies MB1 and MB2 may compriseinterlayer insulating layers and conductive patterns alternatelyarranged in an upper portion of a pipe gate (not shown). A stackedstructure of the interlayer insulating layers and the conductivepatterns will be described below with reference to FIGS. 3B and 3C. Thememory block stack bodies MB1 and MB2 may be formed as a step structurein the contact area CTA.

Each of the memory block stack bodies MB1 and MB2 may be penetrated by asource side lower channel pillar S_CH1, a drain side lower channelpillar D_CH1, a source side upper channel pillar S_CH2, and a drain sideupper channel pillar D_CH2 disposed in the cell area CA. The source sidelower channel pillar S_CH1 and the drain side lower channel pillar D_CH1may extend from a lower pipe channel layer P_CH1. The lower pipe channellayer P_CH1 may be disposed inside a lower pipe groove PA1 in the pipegate (not shown) disposed below the memory block stack bodies MB1 andMB2. The source side upper channel pillar S_CH2 and the drain side upperchannel pillar D_CH2 may extend from an upper pipe channel layer P_CH2.The upper pipe channel layer P_CH2 may be disposed inside an upper pipegroove PA2 in the pipe gate (not shown) disposed below the memory blockstack bodies MB1 and MB2.

The upper pipe channel layer P_CH2 and the lower pipe channel layerP_CH1 may be alternately arranged along the first direction I and asecond direction II crossing each other. Each of the upper pipe channellayer P_CH2 and the lower pipe channel layer P_CH1 may be formed in abar type extending along the second direction II. The lower pipe channellayer P_CH1 may be elongated in the second direction II and longer thanthe upper pipe channel layer P_CH2. Both ends of the lower pipe channellayer P_CH1 may extend along the second direction II so as not tooverlap the upper pipe channel layer P_CH2. The source side lowerchannel pillar S_CH1 and the drain side lower channel pillar D_CH1 maybe arranged adjacent to each other in the second direction II. Thesource side lower channel pillar S_CH1 and the drain side lower channelpillar D_CH1 may extend from both ends of the upper pipe channel layerP_CH1 that does not overlay the upper pipe channel layer P_CH2. Thesource side upper channel pillar S_CH2 and the, drain side upper channelPillar D_CH2 may be arranged to be adjacent to each other in the seconddirection II. The source side upper channel pillar S_CH2 and the drainside upper channel pillar D_CH2 may be disposed with a gap narrower thana gap between the source side lower channel pillar S_CH1 and the drainside lower channel pillar D_CH1. For a dense arrangement, the upper pipechannel layer P_CH2 and the lower pipe channel layer P_CH1 adjacent toeach other along the first direction I may partially overlap with eachother.

The memory block stacked bodies MB1 and MB2 may be penetrated by firstslits SI1A, SI1B, SI1C and SI1D and second slits SI2A and SI2B.

The first slits may include a first sub pattern SI1A second sub patternsSI1B, third sub patterns SI1C, and fourth sub patterns SI1D. The firstsub pattern SI1A may be disposed between the memory block stacked bodiesMB1 and MB2 and extend along the first direction I. The second subpatterns SI1B may be arranged spaced apart along a boundary between thecontact area CTA and the cell area CA, and extend along the seconddirection II, respectively. A portion of the second sub patterns SI1Bmay be connected to the first sub pattern SI1A. The third sub patternsSI1C may be spaced apart from each other in the cell areas CA. The thirdsub patterns SI1C may be spaced apart from one side of the cell areas CAadjacent to the contact area CTA. The fourth sub patterns SI1D may bespaced apart from each other in the contact area CTA.

The second slits SI2A and SI2B may extend along the first direction I.The second slits may include cell area patterns SI2A and contact areapatterns SI2B. The cell area patterns SI2A may be disposed between thesource side lower channel pillar S_CH1 and the drain side lower channelpillar D_CH1 and between the source side upper channel io pillar S_CH2and the drain side upper channel pillar D_CH2. Preferably, the cell areapatterns SI2A may be disposed between the source side upper channelpillar S_CH2 and the drain side upper channel pillar D_CH2. The cellarea patterns SI2A may extend towards the second sub patterns SI1B ofthe first slit to intersect the second sub patterns SI1B. Due to theabove, an overlapping area in which the cell area patterns SI2A overlapthe second sub patterns SI1B may be defined. The cell area patterns SI2Amay separate each of the memory block stacked bodies MB1 and MB2 into asource side stacked body and a drain side stacked body. The source sidestacked body may be a pattern surrounding the source side lower channelpillar S_CH1 and the source side upper channel pillar S_CH2 adjacent toeach other. The drain side stacked body may be a pattern surrounding thedrain side lower channel pillar D_CH1 and the drain side upper channelpillar D_CH2 adjacent to each other. The contact area pattern SI2B maypass through the memory block MB1 and MB2 in the contact area CTA.

An etch stop pad groove SPA may overlap at an intersection of the secondsub pattern SI1B of the first slit and the cell area pattern SI2A of thesecond slit. The pad etch stop groove SPA may be disposed in the pipegate and extend along the second sub pattern SI1B of the first slit. Thesecond sub pattern SI1B may be directly connected to the etch stop padgroove SPA. Alternatively, the second sub pattern SI1B may be connectedto the pad etch stop groove SPA through at least one dummy hole DHpenetrating a portion of the pipe gate between the second sub io patternSI1B and the etch stop pad groove SPA.

The etch stop pad groove SPA and the dummy hole DH may be formed asvarious shapes. For example, the etch stop pad groove SPA and the dummyhole DH may be formed as a rectangular type, a square type, an ovaltype, or a circular type.

The etch stop pad groove SPA may be disposed at the same height as theupper pipe groove PA2. The lower pipe groove PA1 may be placed at aheight lower than the etch stop pad groove SPA and the upper pipe groovePA2. A vertical placement of the etch stop pad groove SPA, the upperpipe groove PA2, and the lower pipe groove PA1 may be shown in FIGS. 3Band 3C.

FIGS. 3B and 3C illustrate cross sectional views of various structurestaken along line A-A′ shown in FIG. 3A. FIG. 3B is a cross sectionalview illustrating the first slits and the second slits spaced apart fromthe etch stop pad groove. FIG. 3C is a cross sectional view illustratingthe first slits and the second slits directly connected to the etch stoppad groove.

Referring to FIGS. 3B and 3C, the memory block stacked body MB2 mayinclude interlayer insulating layers ILD and conductive patterns CPalternately stacked on the pipe gate PG.

The pipe gate PG may be formed of a stacked structure of first to thirdpipe conductive layers PG1 to PG3 as described above in FIG. 2. The etchstop pad groove SPA may be disposed inside the second pipe conductivelayer PG2.

The inter layer insulating layers ILD and the conductive patterns CP maybe penetrated by the first slits SI1A and SI1B and the second slit SI2A.The first slits SI1A and SI1B described In the drawing may be the firstsub pattern SI1A and the second sub pattern SI1B. The second slit SI2Adescribed in the drawing may be the cell area pattern SI2A intersectingthe second sub pattern SI1B of the first slits SI1A and SI1B.Hereinafter, an area in which the second sub pattern SI1B overlaps thecell area patterns SI2A will be referred to as a slit overlapping areaOLA.

The etch stop pad groove SPA may be disposed to overlap the slitoverlapping area OLA. The etch stop pad groove SPA may be connected tothe first slits SI1A and SI1B. More specifically, the etch stop padgroove SPA may be connected to at least one of the first sub patternSI1A and the second sub pattern SI1B.

As shown in FIG. 35, the first slits SI1A and SI1B may extend to anupper surface of the third pipe conductive layer PG3. In this case, thethird pipe conductive layer PG3 between the second sub pattern SI1B ofthe first slits and the etch stop pad groove SPA may be penetrated bythe dummy holes DH. The dummy holes DH may be disposed between the etchstop pad groove SPA and the second sub pattern SI1B. The etch stop padgroove SPA may be connected to the first slits SI1A and SI1B through thedummy holes DH.

Alternatively, as shown in FIG. 3C, the first slits SI1A and SI1B mayextend to an upper surface of the second pipe conductive layer PG2 andbe directly connected to the etch stop pad groove SPA. The first slitsSI1A and SI1B may extend to a bottom surface of the dummy holes DHpassing through the third pipe gate PG3 between the second sub patternSI1B of the first slits and the etch stop pad groove SPA.

Referring to FIGS. 3B and 3C the first slits SI1A and SI1B, the etchstop pad groove SPA, the dummy holes DH, and the cell area pattern SI2Amay be filled with slit insulating layers SIL1 and SIL2. The slitinsulating layer may include a first slit insulating layer SIL1 and asecond slit insulating layer SIL2.

The first insulating layer slit SIL1 may fill the first slits SI1A andSI1B, the etch stop pad groove SPA, and the dummy holes SPA. The secondslit insulating layer SIL2 may fill the cell area pattern SI2A. Inparticular, the second slit insulating layer SIL2 may be formed insidethe first siitinsulating layer SIL1 in the slit overlapping area OLA.Depths of the cell area pattern SI2A and the second slit insulatinglayer SIL2 may be equal to depths of the first slits SI1A and SI1B.

FIG. 4A illustrates a plane view illustrating a layout of a memorydevice according to an embodiment of the present disclosure. FIG. 4Amainly illustrates a cell area CA and a contact area CTA connected toone end of the cell area CA. FIG. 4A is an example of modifying a layoutof the etch stop pad groove and the dummy holes illustrated in FIG. 3A.In FIGS. 3A and 4A, like reference numerals are used to refer: to thesame elements,

Referring to FIG. 4A, the memory device may Include the memory blockstacked bodies MB1 and MB2. Each of the memory block stacked bodies MB1and MB2 includes the cell area CA and the contact area CTA. The contactarea CTA may extend from at least one end of the cell area CA in a firstdirection I The memory block stacked bodies MB1 and MB2 may be formed inthe same layout as described above in FIG. 3A.

Each of the memory block stacked bodies MB1 and MB2 may be penetrated bya source side lower channel pillar S_CH1, a drain side lower channelpillar D_CH1, a source side upper channel pillar S_CH2 and a drain sideupper channelpillar D_CH2 disposed in the cell area CA. The source sidelower channel pillar S_CH1 and the drain side lower channel pillar D_CH1may extend from a lower pipe channel layer P_CH1 disposed inside a lowerpipe groove PA1 in a pipe gate (not shown) disposed below the memoryblock stack bodies MB1 and MB2. The source side upper channel pillarS_CH2 and the drain side upper channel pillar D_CH2 may extend from anupper pipe channel layer P_CH2 disposed inside an upper pipe groove PA2in the pipe gate (not shown) disposed below the memory block stackbodies MB1 and MB2. The source side lower channel pillar S_CH1, thedrain side lower channel pillar the source side upper channel pillarS_CH2,, the drain side upper channel pillar D_CH2, the lower pipechannel layer P_CH1 and the upper pipe channel layer P_CH2 may be formedin the same layout as described in FIG. 3.

The memory block stacked bodies MB1 and MB2 may be penetrated by firstslits SI1A, SI1B, SI1C and SI1D and second slits SI2A and SI2B. Thefirst slit may include a first sub pattern to a fourth sub io patternSI1A, SI1B, SI1C and SI1D arranged in the same Payout described FIG. 3A.The second slits may include cell area patterns SI2A and contact areapatterns SI2B arranged in the same layout described FIG. 3A.

An etch stop pad groove SPA may overlap at an intersection of the secondsub pattern SI1B of the first slit and the cell area pattern SI2A of thesecond slit. The etch stop pad groove SPA may be disposed inside thepipe gate and extend along the cell area pattern SI2A of the secondslit. The cell area pattern SI2A may be directly connected to the etchstop pad groove SPA. Alternatively, the cell area pattern SI2A may beconnected to the etch stop pad groove SPA through at least one dummyhole DH penetrating a portion of the pipe gate between the cell areapattern SI2A and the etch stop pad groove SPA.

FIGS. 4B and 4C cross sectional views illustrating various structuresaken ilong line B-B′ shown in FIG. 4A.

FIG, 4B is a cross sectional view illustrating an example of the firstslits and the second slits spaced apart from the etch stop pad groove.FIG. 4c is a cross sectional view illustrating an example of the firstslit and the second directly connected to the etch stop pad groove.

Referring to FIGS. 48 and 4C, the memory block stacked bodies M81 andM82 may include interlayer insulating layers ILD and conductive patternsCP alternately stacked over the pipe gate PG.

The pipe gate PG may be formed of a stacked structure of first to thirdpipe conductive layers PG1 to PG3 as described above in FIG. 2. The etchstop pad groove SPA may be disposed inside the second pipe conductivelayer PG2.

The inter layer insulating layers ILD and the conductive patterns CP maybe penetrated by the first slit SI1B and the second silt SI2A. The firstslit 5118 shown in the drawing may be the second sub pattern SI1B. Thesecond slit SI2A shown in the drawing may be the cell area pattern SI2Acrossing the second sub pattern SI1B. Hereinafter, an area in which thesecond sub pattern SI1B overlaps the cell area pattern SI2A will bereferred to as a slit overlapping area OLA.

The etch stop pad groove SPA may be disposed to overlap the slitoverlapping area OLA, The etch stop pad groove SPA may be connected tothe cell area pattern SI2A.

As shown in FIG. 48, the cell area pattern. SI2A may extend to an uppersurface of the third pipe conductive layer PG3. In this case, the thirdpipe conductive layer PG3 between the cell area pattern SI2A of thesecond slit and the etch stop pad groove SPA may be penetrated by thedummy hole DH. The dummy holes DH may be disposed between the cell areapattern SI2A and the etch stop pad groove SPA. The etch stop pad grooveSPA may be connected to the cell area pattern SI2A through the dummyhole DH. The first slits including the second sub pattern SI1B mayextend to the upper surface of the third pipe conductive layer PG3.

As shown in FIG. 4C, the cell area pattern SI2A of the second slit mayextend to an upper surface of the second pipe conductive layer PG2 andbe directly connected to the etch stop pad groove SPA. In this case, thecell area pattern SI2A may extend to a bottom surface of the dummy holesDH penetrating the third pipe gate PG3 between the cell area patternSI2A and the etch stop pad groove SPA. The first slits including thesecond sub patterns SI1B may extend to the upper surface of the secondpipe conductive layer PG2.

Referring to FIGS. 4B and 4C, the second sub pattern SI1B of the firstslit, the etch stop pad groove SPA, the dummy hole DH, and the cell areapattern SI2A of the second slit may be filled with slit insulatinglayers SIL1 and SIL2. The slit insulating layers may include a firstslit insulating layer SIL1 and a second slit insulating layer SIL2.

The first slit insulating layer SIL1 may fill the second sub patternSI1B. The second slit insulating layer SIL2 may fill the cell areapattern SI2A, the etch stop pad groove SPA and the dummy hole DH. Inparticular, the second slit insulating layer SIL2 may be formed insidethe first slit insulating layer SIL1 in the slit overlapping area OLA. Adepth of the first slit including the second sub pattern SI1B and adepth of the first slit insulating layer SIL1 may be equal to a depth ofthe cell area pattern SI2A.

As described above, in the embodiments of the present disclosure theetch stop pad groove SPA may overlap the slit overlapping area OLA. Theetch stop pad groove SPA may be filled with an etch stop pattern duringa manufacturing process of a three dimensional semiconductor memorydevice. Accordingly, the etch stop pattern inside the etch stop padgroove SPA may prevent a conductive layer such as, a pipe gate PG or asubstrate in a lower portion of the slit overlapping area OLA from beingdamaged during the manufacturing process of the first slit or the secondslit.

Hereafter, referring to FIGS. 5A to 10C, a method of manufacturing asemiconductor device according to an embodiment of the presentdisclosure will be described in more detail below.

FIGS. 5A to 8C illustrate cross sectional views for a manufacturingmethod of a memory device, according to an embodimen t of the presentdisclosure. FIGS. 5A to 8C are cross sectional views taken along thelines A-A′, C-C and D-D′ shown in FIG. 3A.

FIGS. 5A to 5C are cross sectional views illustrating a process offorming an etch stop pattern.

Referring to FIG. 5A, a pipe gate PG in which sacrificial layers 107A,103, and 107B are embedded may be formed.. The sacrificial layers 107A,103, and 107B may include a pad sacrificial layer 107A filling an etchstop pad groove SPA, a lower pipe sacrificial layer 103 filling a lowerpipe groove PA1, and an upper pipe sacrificial layer 107B filling anupper pipe groove PA2.

The sacrificial layers 107A, 103, and 107B may be formed of a materialdifferent from the pipe gate PG and have an etch selectivity to the pipegate PG. For example, the sacrificial layers 107A, 103, and 107B may beformed of a nitride layer.

An example of a manufacturing process of the pipe gate PG in which thesacrificial layers 107A, 103 and 107B are embedded will be described inmore detail as follows.

First, a first pipe conductive layer 101 may be formed on a substrate(not shown). Thereafter, the first pipe conductive layer 101 may beetched so that the lower pipe groove PA1 is formed therein, The firstpipe conductive layer 101 may be formed of a conductive material such aspolysilicon. Subsequently, the lower pipe sacrificial layer 103 may fillthe first pipe groove PA1 in the first pipe conductive layer 101. Tothis end, a manufacturing process of forming the a first sacrificiallayer that completely fills the first pipe groove PA1 in the first pipeconductive layer 101, and a manufacturing process of planarizing anupper surface of the first sacrificial layer so that an upper surface ofthe first pipe conductive layer 101 is exposed may be sequentiallyperformed. Before forming the first sacrificial layer, a buffer layer(not shown) may be formed on a surface of the first pipe groove PA1. Thebuffer layer may be an oxide layer.

Subsequently, a second pipe conductive layer 105 may be formed on thefirst pipe conductive layer 101 to cover the lower pipe sacrificiallayer 103. The second pipe conductive layer 105 may formed of aconductive material such as polysilicon. Thereafter, by partiallyetching a portion of the second pipe conductive layer 105, the etch stoppad groove SPA and the upper pipe groove PA2 may be simultaneouslyformed therein. Subsequently, the pad sacrificial layer 107A filling theetch stop pad groove SPA and the upper pipe sacrificial layer 107Bfilling the upper pipe groove PA2 may be simultaneously formed in thesecond io pipe conductive layer 105. The pad sacrificial layer 107A andthe upper pipe sacrificial layer 107B may be formed by sequentiallyperforming a manufacturing process of forming a second sacrificial layerhaving a thickness that completely fills the etch stop pad groove SPAand the upper pipe groove PA2 in the second pipe conductive layer 105,and a manufacturing process of planarizing ani upper surface of thesecond sacrificial layer so that an upper surface of the second pipeconductive layer 105 is exposed. The second sacrificial layer may beformed of the same material as the first sacrificia layer. Morespecifically the second sacrificial layer may be a nitride layer. Beforethe second sacrificial layer is formed, a buffer layer (not shown) maybe further formed on surfaces of the etch stop pad groove SPA and theupper pipe groove PA2. The buffer layer may be an oxide layer.

Subsequently, a third pipe conductive layer 109 may be formed on thesecond pipe conductive layer 105 so as to cover the pad sacrificiallayer 107A and the upper pipe sacrificial layer 107B. The third pipeconductive layer 109 may be formed of a conductive material such aspolysilicon.

The pipe gate PG in which the sacrificial layers 107A, 103, and 107B areembedded may be formed through the above described process.

Subsequently, a first interlayer insulating layer 111 may be formed onthe pipe gate PG. The first interlayer insulating layer 111 may be thesame material as a second material layer formed in sequence, in io moredetail, the first interlayer insulating layer 111 may be an oxide layer.

Thereafter, holes DH, HA1 and HA2 exposing the sacrificial layers 107A,103 and 107B may be formed by etching a portion of the first interlayerinsulation layer 111 and a portion of the pipe gate PG. The holes mayinclude a dummy hole DH, lower pipe opening holes HA1 and upper pipeopening holes HA2. The dummy hole DH may pass through the third pipeconductive layer 109 to expose an upper surface of the pad sacrificiallayer 107A. The lower pipe opening holes HA1 may pass through the thirdpipe conductive layer 109 and the second pipe conductive layer 105 toexpose an upper surface of the lower pipe sacrificial layer 103. Thelower pipe sacrificial layer 103 may be exposed by at least one pair ofthe lower pipe opening holes HA1. The upper pipe opening holes HA2 maypass through the third pipe conductive layer 109 to expose an uppersurface of the upper pipe sacrificial layer 107B. The upper pipesacrificial layer 107B may be exposed by at least one pair of the upperpipe opening holes HA2. The dummy holes DH may be simultaneously formedwith the upper pipe opening holes HA2.

Referring to FIG. 5B, the sacrificial layers 107A, 103, and 107B may beremoved through the holes DH, HA1, and HA2. Thus, the etch stop padgroove SPA, the lowerpipe groove PA1, and the upper pipe groove PA2 maybe opened.

Referring to FIG. 5C, an etch barrier material layer having a thicknessthat completely fills the etch stop pad groove SPA, the lower pipegroove PA1, the upper pipe groove PA2, the dummy hole DH, the lower pipeopening holes HA1 and the upper pipe opening holes HA1 may be formed onthe first interlayer insulating layer 111 and the pipe gate PG.Thereafter, the etch barrier material layer may be planarized until anupper surface of the first interlayer insulating layer 111 is exposed.Thus, an etch stop pattern 113A filling the etch stop pad groove SPA andthe dummy hole DH, a lower protective layer 113B filling the lower pipegroove PA1 and the lower pipe opening holes HA1 connected thereto and anupper protective layer 113C filling the upper pipe groove PA2 and theupper pipe opening holes HA2 connected thereto may be simultaneouslyformed.

The etch barrier material layer may be formed of a different materialfrom first material layers and second material layers formed in asubsequent process such as, the first material layers 121 and secondmaterial layers 123 shown in FIGS. 6A and 6B). More specifically, theetch barrier material layer may be formed of a material having an etchselectivity to the first material layers and the second material layersformed in the subsequent process. For example, the etch barrier materiallayer may include at least one of titanium nitride, tungsten, tungstensilicide, cobalt silicide, and nickel silicide.

As described in FIGS. 5A to 5C, in the embodiment of the presentdisclosure, the etch stop pad groove SPA and the upper pipe groove PA2may be simultaneously formed. The dummy holes DH, the lower pipe openinghole PA1 and the upper pipe opening hole PA2 may be simultaneouslyformed, and the etch stop pattern 113A, the lower protective layer 113Band the upper protective layer 113C may be simultaneously formed. Thus,according to the embodiments of the present disclosure, a processingcost may be reduced and a process of manufacturing a semiconductordevice may be simplified.

FIGS. 6A and 6B are cross sectional views illustrating a forming processof channel layers.

Referring to FIG. 6A, first material layers 121 and second materiallayers 123 may be alternately stacked on the first interlayer insulatinglayer 111 to cover the etch stop pattern 113A, the lower protectivelayer 113B, and the upper protective layer 113C. More specifically, thefirst material layers 121 may be formed of a material having an etchselectivity to the second material layer 123. The second material layers123 may be formed of a silicon oxide layer serving as a secondinterlayer insulating layer. The first material layer 121 may include anitride layer.

Subsequently, channel holes HB1 and HB2 that expose the lower protectivelayer 113B and the upper protective layer 113C may be formed by etchingthe first material layers 121 and the second material ayer 123. Thechannel holes may include first channel holes HB1 and second channelholes HB2. The first channel holes HB1 may pass through the firstmaterial layers 121 and the second material layers 123, expose the lowerprotective layer 113B and are connected to the lower pipe opening holesHA1. The second channel holes HB2 may pass through the first materiallayers 121 and the second material layers 123, expose the upperprotective layer 113C and are connected to the upper pipe opening holesHA2.

Referring to FIG. 68, the lower protective layer 113B and the upperprotective layer 113C may be removed via the channel hole HB1 and HB2.Thus, the lower pipe groove PA1 and the lower pipe opening holes HA1connected thereto may be opened, and the upper pipe groove PA2 and theupper pipe opening holes HA2 connected thereto may be opened. The lowerpipe groove PA1, the lower pipe opening holes HA1, and the first channelholes HB1 connected to one another may define a first string holestructure, and the upper pipe grooves PA2, the upper pipe gate holesHA2, and the second channel holes HB2 connected to one another maydefine a second string hole structure

Subsequently, a multilayer may be formed on a surface of the firststring hole structure and a surface of the second string hole structure,the multilayer may be planarized. Thus, the multilayer may be separatedinto a first multilayer pattern 131A within the first string holestructure and a second multilayer pattern 131B within the second stringhole structure. Each of the first multilayer pattern 131A and the secondmultilayer pattern 131B may be formed of a stacked structure of ablocking insulating layer, a data storage layer and a tunnel insulatinglayer. The blocking insulating layer may be formed of an oxide layercapable of blocking a charge. The data storage layer may be formed of asilicon nitride layer capable of a charge trap, The tunnel insulatinglayer may be formed of a silicon oxide layer capable of a chargetunneling.

Thereafter, a channel layer may be formed on the first multilayerpattern 131A and the second multilayer pattern 131B. The channel layeray be formed of a semiconductor layer such as silicon. The channel layermay be formed as a tubular-type along an inner wall of the first stringhole structure and the second string hole structure, or as a buried-typecompletely filling the first string hole structure and the second stringhole structure. The channel layer may be planarized. Thus, the channellayer may be separated into a lower channel layer 133A within the firststring hole structure and an upper channel layer 133B within the secondstring hole structure.

The lower channel layer 133A may extend along the first channel holesH81, the lower pipe opening holes HA1, and the lower pipe groove PA1.The lower channel layer 133A may include a lower pipe channel layerP_CH1 and a drain side lower channel pillar D_CH1 and a source sidelower channel pillar S_CH1 extended from the lower pipe channel layerP_CH1. The lower pipe channel layer P_CH1 may be disposed inside thelower pipe groove PA1. The drain side lower channel pillar D_CH1 may bedisposed inside one of the first channel holes H81 and the lower pipeopening, hole HA1 connected thereto. The source side lower channelpillar S_CH1 may be disposed inside one of the other first channel holesHB1 and the lower pipe opening hole HA1 connected thereto.

The upper channel layer 133B may extend along the second channel holesH82, the upper pipe opening holes HA2, and the upper pipe groove PA2.The upper channel layer 133B may include an upper pipe channel layerP_CH2 and a drain side upper channel pillar D_CH2 and a source sideupper channel pillar S_CH2 extended from the upper pipe channel layerP_CH2. The upper pipe channel layer P_CH2 may be disposed inside theupper pipe groove PA2. The drain side upper channel pillar D_CH2 may bedisposed inside one of the second channel holes HB2 and the upper pipeopening holes HA2 connected thereto. The source side upper channelpillar S_CH2 may be disposed inside one of the other second channe holesHB2 and the upper pipe opening hole HA2 connected thereto.

When the lower channel layer 133A and the upper channel layer 133B areformed as the tubular-type, a first core insulating layer 135A filling acentral area of the lower channel layer 133A and a second core insultinglayer 135B filling a central area of the upper channel layer 133B may befurther formed. Both ends of the first core insulating, layer 135A andthe second core insulting layer 135B may be formed at a lower heightthan both ends of the lower channel layer 133A and the upper channellayer 133B. In this case, first doped patterns 137A contacted to bothends of the lower channel layer 133A may be formed on the first coreinsulating layer 135A. In addition, second doped patterns 137Bcontacting both ends of the upper channel layer 133B may be formed onthe second core insulating layer 135B. The first doped patterns 137A andthe second doped patterns 137B may be used as a junction and formed in adoped polysilicon.

FIGS. 7A to 7C are cross sectional views illustrating a process offorming a first slit insulating layer.

Referring to FIG. 7A, a first slit SI1 may be formed by etching thefirst material layers 121 and the second material layers 123. The firstslit SI1 penetrates the first material layers 121 and the secondmaterial layers 123. The first slit SI1 may correspond to the first subpattern SI1A and the second sub pattern SI1B illustrated in FIG. 3A. Atleast a portion of the first slit SI1 may overlap the etch stop pattern113A.

The first slit SI1 may extend to an upper surface of the pipe gate PGand be connected to the dummy hole DH, which corresponds to FIG. 3B.Alternatively, as indicated by a broken line, the first slit SI1 mayextend to a bottom surface of the dummy hole DH to connect to the etchstop pad groove SPA which corresponds to FIG. 3C.

The etch stop pattern 113A may be formed of a material having an etchselectivity to the first material layers 121 and the second materiallayers 123. In particular, the first etch stop pattern 113A may beformed of a material having a higher etch selectivity to the firstmaterial layers 121 and the second material layers 123, than the pipegate PG. For example, the first etch stop pattern 113A may be formed ofTiN. Accordingly, during forming the first slits SI1, a bottom surfaceof the first slit SI1 may be arranged on an upper surface of the etchstop pad groove SPA filled with the etch stop pattern 113A.

Referring to FIG. 7B, the pad etch stop groove SPA and the dummy hole DHmay be opened by removing the etch stop pattern 113A io through thefirst slit SI1.

Referring to FIG. 7C, a first slit insulating layer 141 is formed suchthat the first slit insulating layer 141 fills the first slit SI1, theetch stop pad groove SPA and the dummy hole DH. When the bottom surfaceof the first slit SI1 extends to a height of the etch stop pad grooveSPA, a cross section of the first slit insulating layer 141 may beformed as the same structure as the first slit insulating layer SIL1shown in FIG. 3C.

FIGS. 8A to 8C are cross sectional views for describing a process offorming a second slit insulating layer.

Referring to FIG. 8A, by etching the first material layers 121 and thesecond material layers 123, second slits 512 penetrating thereof may beformed. The second slits SI2 may correspond to the cell area patternSI2A shown in FIG. 3A. Each of the second slits SI2 may extend tbintersect the first slit SI1 at an overlapping portion of the first slitSI1 and the etch stop pad groove SPA.

An area in which the first slit SI1 and the second slits SI2 overlapeach other may be defined as a slit overlapping area OLA. A portion ofeach of the second slits SI2 may extend from the slit overlapping areaOLA to the inside of the first slit insulating layer 141.

Since the pipe gate PG is protected by the etch stop pattern 113A inFIG. 7A) inside the etch stop pad groove SPA during a process of formingthe first slit SI1, an etch amount of the pipe gate PG in the slitoverlapping area OLA is significantly reduced. Accordingly, a total etchamount of the pipe gate PG may not significantly increase even throughio the pipe gate PG is etched in the slit overlapping area OLA during aprocess for forming the second slits SI2. In addition, while forming thesecond slits SI2, the etch amount of the pipe gate PG in the slitoverlapping area OLA may be reduced by a portion of the first slitinsulating layer 141 disposed in a large thickness in the etch stop padgroove SPA.

Referring to FIG. 8B, the first material layers 121 may be replaced withconductive patterns 143 through the second slits SI2. A process ofreplacing the first material layers 121 with the conductive patterns 143may include opening conductive pattern areas by removing the firstmaterial layers 121 through the second slits SI2, forming a conductivematerial to fill the conductive pattern areas, and separating theconductive material into the conductive patterns 143 by removing theconductive material inside the second silts SI2.

Referring to FIG. 8C, the second slits SI2 may be filled with a secondslit insulating layer 145.

FIGS. 9 to 10C are cross sectional views for describing a method formanufacturing a semiconductor device according to an embodiment of thepresent disclosure. FIGS. 9 to 10C of are cross sectional views takenalong lines A-A′, E-E and F-F′ illustrated in FIG. 4A.

FIGS. 9 to 10C illustrate cross sectional views for a manufacturingmethod of a memory device, according to an embodiment of the presentdisclosure.

FIG. 9 is a sectional views illustrating a process of forming a firstslit SI1.

Referring to FIG. 9, a pipe gate PG in which an etch stop pattern 213Ais buried may be formed by using the same processes described in FIGS.5A to 5C. The etch stop pattern 213A may be formed to fill an etch stoppad groove SPA and a dummy hole DH connected thereto. The etch padgroove SPA may be formed in the pipe gate PG and the dummy hole DH maybe connected to the etch stop pad groove SPA. The dummy hole DH maypenetrate the pipe gate PG above the etch stop pad groove SPA and afirst interlayer insulating layer 211 above the pipe gate PG.

An upper pipe groove PA2 may be arranged at the same height as the etchstop pad groove SPA and a lower pipe groove PA1 may be arranged at aheight lower than the upper pipe groove PA2 and the etch stop pad grooveSPA.

Subsequently, a lower channel layer 233A and an upper channel layer 2338may be formed by using the same process described above in FIGS. 6A and6B, Before forming the lower channel layer 233A and the upper channellayer 2336, a first multilayer pattern 231A and a second multilayerpattern 2316 may be further formed. After forming the lower channe layer233A and the upper channel layer 2336, a first core insulating layer235A and a second core insulating layer 2358 filling each of centralareas thereof may be further formed. In addition, after forming thelower channel layer 233A and the upper channel layer 2336, first dopedpatterns 237A contacted to both ends of the lower channel layer 233A andsecond doped patterns 237B contacted to both ends of the upper channellayer 233 B may be formed on each of the first core insulating layer235A and the second core insulating layer 2356.

The lower channel layer 233A may include a lower pipe channel layerP_CH1 disposed inside the lower pipe groove PA1 a drain side lowerchannel pillar D_CH1 extended from the lower pipe channel layer P_CH1and a source side lower channel pillar S_CH1 extended from the lowerpipe channel layer P_CH1. The upper channel layer 233B may include anupper pipe channel layer P_CH2 disposed inside the upper pipe groovePA2, a drain side upper channel pillar D_CH2 extended from the upperpipe channel layer P_CH2, and a source side upper channel pillar S_CH2extended from the upper pipe channel layer P_CH2.

Subsequently, by etching first material layers 221 and second materiallayers 223, the first slit SI1 penetrating thereof ay be formed. Thefirst slit SI1 may correspond to the second sub pattern SI1B shown inFIG. 4A. At least a portion of the first slit SI1 may overlap the etchstop pattern 213A.

The first slit SI1 may be arranged so as not to overlap the dummy-holeDH.

FIGS. 10A to 10C are cross sectional views for describing a method forforming a second slit insulating layer.

Referring to FIG. 10A, after filling the first slit SI1 with a firstslit insulating layer 241, the second slits SI2 penetrating the firstmaterial layers 221 and the second material layers 223 may be formed byetching io the first material layers 221 and the second material layers223. The second slits SI2 may correspond to the cell area pattern SI2Ashown in FIG. 4A. Each of the second slits SI2 may extend across thefirst slit SI1 at an overlapping portion of the first slit SI1 and theetch stop pad groove SPA.

In the slit overlapping area OLA in which the first slits SI1 overlapthe second slits SI2, a portion of the second slits SI2 may extend tothe inside of the first slit insulating layer 241. Each of the secondslits SI2 may overlap the dummy holes DH corresponding thereto. The etchstop pattern 213A may be exposed through the second slits SI2.

During a process for forming the second slits SI2, the etch stop pattern213A may prevent an over etch of the pipe gate PG in the slitoverlapping area OLA. In particular, since the etch stop pattern 213Amay be formed of a material such as, TiN having a higher etchselectivity to the first material layers 221 and the second materiallayers 223, than the pipe gate PG, the over etch of the pipe gate PG inthe slit overlapping area OLA may be prevented more efficiently ratherthan in the case in which the pipe gate PG is used as an etch stoplayer.

Referring to FIG. 10B, the first material layers 221 may be replacedwith conductive patterns 243 through the second slits SI2. A process forreplacing the first material layers 221 with the conductive patterns 243is the same as described in FIG. 8B.

Referring to FIG, 10C, the etch stop pad groove SPA and the dummy holeDH may be opened by removing the etch stop pattern 213A through each ofthe second slits SI2. The etch stop pattern 213A may be removed by usingsulfuric acid. Subsequently, a second slit insulating layer 245 may beformed such that the second slit insulating layer 245 fills each of thesecond slits SI2 the etch stop pad groove SPA and the dummy hole DH.When a bottom surface of the first slit SI1 and the second slits SI2extend to the height of the etch stop pad groove SPA, a cross section ofthe first slit insulating layer 241 and the second slit insulating layer245 may be formed in the same structure of the first slit insulatinglayer SIL1 and the second silt insulating layer SIL2 illustrated in FIG.4C.

FIG. 11 is a configuration view illustrating a memory system accordingto an embodiment of the present disclosure,

Referring to FIG. 11, a memory system 1100 according to the embodimentof the present disclosure may include a memory device 1120 and a memorycontroller 1110.

The memory device 1120 may include the structure described in FIGS. 2 to4C. For example, the memory device 1120 may include interlayerinsulating layers and conductive patterns alternately stacked over apipe gate; a first slit and a second slit penetrating the interlayerinsulating layers and the conductive patterns and crossing each other;an etch stop pad groove overlapping an intersection of the first slitand the second slit, arranged in the pipe date, and connected to thefirst slit or the second slit; a slit insulating layer filling the firstslit, the second slit and the etch stop pad groove.

The memory device 1120 may be a multichip package including a pluralityof flash memory chips.

The memory controller 1110 may be configured to control the memorydevice 1120 and include a static random access memory (SRAM) 1111, a CPU1112, a host interface 1113, an error correction code (ECC) 1114 and amemory interface 1115. The SRAM 1111 may be used as a working memory ofthe CPU 1112, the CPU 1112, may perform the various control operationsfor a data exchange of the memory controller 1110 and the host interface1113 and may include a data exchange protocol of a host connecting tothe memory system 1100. In addition, the ECC 1114 may detect and correcterrors included in data read from the memory device 1120, and the memoryinterface 1115 may perform interfacing with the memory device 1120. Inaddition, the memory controller 1110 may further include a read onlymemory (ROM) for storing code data used for interfacing with the host.

The above described memory system 1100 may be a memory card in which thememory device 1120 and the controller 1110 are combined or a solid statedisk SSD, For example, the memory system 1100 is the SSD, the controller1110 may communicate with external sources for example, a host, throughone of various interface protocols such as an universal serial bus(USB), a multimedia card (MMC), a peripheral component interconnectionexpress (PCIE), a serial advanced technology attachment (SATA), aparallel advanced technology attachment (PATA), a small computer smallinterface (SCSI), enhanced small disk interface (ESDI), and integrateddrive electronics (IDE).

FIG. 12 illustrates a configuration diagram of a computing system,according to an embodiment of the present disclosure.

Referring to FIG, 12, a computing system 1200 according to theembodiment of the present disclosure may include a CPU 1220, a randomaccess memory (RAM) 1230, a user interface 1240, a modem 1250, and amemory system 1210, coupled to a system bus 1260. Further, when thecomputing system 1200 is a mobile device, a battery may be furtherincluded to supply an operating voltage to the computing system 1200.Additionally, an application chipset, a camera image processor CIS, anda mobile DRAM may be further included.

The memory system 1210 may include a memory device 1212 and a memorycontroller 1211 as described with reference to FIG. 11.

In the embodiment of the present disclosure, a space in which an etchstop pattern is formed may be provided by forming an etch stop padgroove at an overlapping portion of a first slit and a second slit.Thus, an over etch in the overlapping portion of the first slit and thesecond slit may be prevented through the etch stop pattern. As a result,according to the embodiment of the present disclosure, an operationalreliability of a semiconductor device may be improved by reducing aleakage current at the overlapping portion of the first slit and thesecond slit.

The spirit of the present disclosure has been written in detail inaccordance with the preferred embodiment, the above embodiment is fordescription purposes only and it should be noted that it is not intendedto limit the present disclosure. Additionally, ordinary experts in theart will appreciate the variety of possible example embodimentsavailable within the scope of the disclosure.

What is claimed is:
 1. A semiconductor device comprising: interlayerinsulating layers and conductive patterns alternately stacked over apipe gate; a first slit and a second slit penetrating the interlayerinsulating layers and the conductive patterns, and crossing each other;an etch stop pad groove overlapping an, intersection of the first slitand the second slit, arranged in the pipe gate, and connected'to thefirst slit or the second slit: and slit insulating layers filling thefirst slit, the second slit and the etch stop pad groove.
 2. Thesemiconductor device of claim 1, further comprising: an upper pipegroove arranged in the pipe gate extending along a is first directionand a second direction which cross each other; an upper pipe channellayer arranged in the upper pipe groove; and at least one pair of upperchannel pillars extended from the upper pipe channel layer to a thirddirection perpendicular to a surface of the pipe gate, and penetratingthe interlayer insulating layers and the conductive patterns.
 3. Thesemiconductor device of claim 2, wherein the etch stop pad groove isarranged at a same height as the upper pipe groove.
 4. The semiconductordevice of claim 2, wherein the second slit is arranged between the upperchannel pillars and extends along the first direction
 5. Thesemiconductor device of claim 2, further comprising: a lower pipe groovearranged in the pipe gate and spaced apart from the upper pipe groove ata lower height than the upper pipe groove; a lower pipe channel layerarranged in the lower pipe groove; and at least one pair of lowerchannel pillars extending from the lower pipe channel layer in the thirddirection, and penetrating the interlayer insulating layers and theconductive patterns.
 6. The semiconductor device of claim 5, wherein thelower pipe: groove is arranged at a lower height than the etch stop padgroove.
 7. The sem conductor device of claim wherein the slit insulatinglayers comprise: a first slit insulating layer filling the first slitand the etch stop pad groove; and a second slit insulatinglayer fillingthe second
 8. The semiconductor device of claim 7, further comprising:the etch stop pad groove extending along the first slit; and a dummyhole penetrating the pipe gate between the first slit and the etch stoppad groove, wherein the dummy hole is filled with the first slitinsulating layer.
 9. The semiconductor device of claim wherein the slitinsulating layers comprise: a first slit insulating layer filling thefirst slit; and a second slit insulating layer filling the second slitand the etch stop pad groove.
 10. The semiconductor device of claim 9,further comprising: the etch stop pad groove extending along the secondslit; and a dummy hole penetrating the pipe gate between the second slitand the etch stop pad groove, wherein the dummy hole is filled with thesecond slit insulating layer,
 11. A manufacturing method of asemiconductor device, the manufacturing method comprising: forming apipe gate in which an etch stop pad groove filled with an etch stoppattern is formed; alternately stacking first material layers and secondmaterial layers over the pipe gate; forming a first slit penetrating thefirst material layers and the second material layers and overlapping theetch stop pattern; opening the etch stop pad groove by removing the etchstop pattern through the first slit; forming a first slit insulatinglayer filling the first slit and the etch stop pad groove; and forming asecond penetrating the first material layers and the second materiallayers, the second slit crossing the first slit at an overlappingportion of the first slit and the etch stop pad groove.
 12. Themanufacturing method of claim 11, wherein the etch stop pattern includesat least one of titanium nitride, tungsten, tungsten silicide, cobaltsilicide and nickel silicide.
 13. The manufacturing method of claim11,wherein the forming of the pipe gate comprises: forming a secondconductive layer over a first conductive layer; forming the etch stoppad groove by etching the second conductive layer; forming a padsacrificial layer filling the etch stop pad groove; forming a thirdconductive layer over the second conductive layer to cover the padsacrificial layer; forming a dummy hole penetrating the third conductivelayer to expose an upper surface of the pad sacrificial layer; openingthe etch stop pad groove by removing the pad sacrificial layer throughthe dummy hole; and filling the etch stop pad groove and the dummy holewith the etch stop pattern.
 14. The manufacturing method claim 13,further comprising: forming a lower pipe groove by etching the firstconductive layer before forming the second conductive layer; forming alower pipe sacrificial layer filling the lower pipe groove; forming anupper pipe groove by etching the second conductive layer when formingthe etch stop pad groove; forming an upper pipe sacrificial layerfilling the upper pipe groove when forming the pad sacrificial layer;forming at least one pair of lower pipe opening holes exposing an uppersurface of the lower pipe sacrificial layer, and at least one pair ofupper pipe opening holes exposing an upper surface of the upper pipesacrificial layer by etching at least one of the second conductive layerand the third conductive layer when forming the dummy hole; removing thelower pipe sacrificial layer and the upper pipe sacrificial layerthrough the lower pipe opening holes and the upper pipe opening holes,respectively when removing the pad sacrificial layer; and forming alower protective layer filling the lower pipe groove and the lower pipeopening holes, and an upper protective layer filling the upper pipegroove and the upper pipe opening holes when forming the etch stoppattern.
 15. The manufacturing method of claim 14, further comprising:forming first channel holes connected to the lower pipe opening holesand second channel holes connected to the upper pipe opening holes byetching the first material layers and the second material layers;removing the upper protective layer and the lower protective layerthrough the first channel holes and the second channel holes; andforming a lower channel layer extending along the first channel holes,the lower pipe opening holes, and the lower pipe groove, and an upperchannel layer extending along the second channel holes, the upper pipeopening holes, and the upper pipe groove
 16. The manufacturing method ofclaim 15, wherein the second slit is disposed between the first channelholes and bet een the second channel holes
 17. The manufacturing methodof claim 11, further comprising: replacing the first material layerswith conductive patterns through the second slit.
 18. A manufacturingmethod of a semiconductor device, the manufacturing method comprising:forming a pipe gate in which an etch stop pad groove filled with an etchstop pattern is formed; alternately stacking first material layers andsecond materiallayers over the pipe gate; forming a first slitpenetrating the first material layers and the second material layers andoverlapping the etch stop pattern; forming a first slit insulating layerin the first slit; forming a second slit penetrating the first materiallayers and the second material layers, the second slit intersecting thefirst slit at an overlapping portion of the first slit and the etch stoppad groove; removing the etch stop pattern through the second slit; andforming a second sl it insulating layer filing the second silt and theetch stop pad groove.
 19. The manufacturing method of claim 18, whereinthe etch stop pattern includes at least one of titanium nitride,tungsten tungsten silicide, cobalt silicide, and nickel silicide. 20.The manufacturing method of claim 18, wherein the forming of the pipegate comprises: forming a second conductive layer over a firstconductive layer; forming the etch stop pad groove by etching the secondconductive layer; forming a pad sacrificial layer filling the etch stoppad grove; forming a third conductive layer over the second conductivelayer to cover the pad sacrificial laye forming a dummy hole penetratingthe third conductive layer to expose an upper surface of the padsacrificial layer; opening the etch stop pad groove by removing the padsacrificial layer through the dummy hole; and filling the etch stop padgroove and the dummy hole with the etch stop pattern.
 21. The an uringmethod of claim20, furthercomprising: forming a lower pipe groove byetching the first conductive layer before forming the second conductivelayer; is forming a lower pipe sacrificial layer filling the lower pipegroove; forming an upper pipe groove by etching the second conductivelayer when forming the etch stop pad groove; forming an upper pipesacrificial layer ng the upper pipe groove when forming the padsacrificial layer; forming at least one pair of lower pipe opening holesexposing an upper surface of the lower pipe sacrificial layer, and atleast one pair of upper pipe opening holes exposing an upper surface ofthe upper pipe sacrificial layer by etching at least one of the secondconductive layer and the third conductive layer when forming the dummyholes; removing the lower pipe sacrificial layer and the upper pipesacrificial layer through the lower pipe opening holes and the upperpipe opening holes, respectively when removing the pad sacrificiallayer; and forming a lower protective layer filling the lower pipegroove and the lower pipe opening holes and an upper protective layerfilling the upper pipe groove and the upper pipe opening holes whenforming the etch stop pattern,
 22. The manufacturing method of claim 21,further comprising: forming first channel holes connected to the lowerpipe opening holes and second channel holes connected to the upper pipeopening holes by etching the first material, layers and the secondmaterial layers; removing the lower protective layer and the upperprotective layer through the first and second channel holes; and forminga lower channel layer extending along the first channel holes, the lowerpipe opening holes, and the lower pipe groove, and an upper channellayer extending along the second channel holes, the upper pipe openingholes, and the upper pipe groove.
 23. The manufacturing method of claim22, wherein the second slit is arranged between the first channel holesand between the second channel holes.
 24. The manufacturing method ofclaim 18, further comprising: replacing the first material layers withconductive patterns through the second slit.